Durable Non-Wetting Coating on Fluid Ejector

ABSTRACT

A method of forming a nozzle plate of a fluid ejection device includes etching a bore in the first side of the multi-layer substrate, depositing a liner in the bore, removing a layer from a second side of the multi-layer substrate, wherein the removing exposes a closed end of the liner, applying a non-wetting coating to the closed end of the liner and an area surrounding the closed end of the liner, and removing the closed end of the liner, wherein removing the closed end of the liner opens a nozzle.

TECHNICAL FIELD

This disclosure relates generally to coatings on fluid ejectors.

BACKGROUND

A fluid ejector (e.g., an ink jet printhead) typically has an interiorsurface, an orifice through which fluid is ejected, and an exteriorsurface. When fluid is ejected from the orifice, the fluid canaccumulate on the exterior surface of the fluid ejector, divertingfurther fluid from an intended path of travel or blocking it entirely(e.g., due to surface tension). Some materials from which fluid ejectorsare fabricated (e.g., silicon) are hydrophilic, which typicallyexacerbates the problem of accumulation when fluids are ejected.

Non-wetting coatings can be used to coat surfaces. However, some typesof materials are soft and are not durable coatings. Some coatings alsocan be expensive and difficult to pattern.

SUMMARY

In one aspect, a method of forming a nozzle plate of a fluid ejectiondevice includes etching a bore in the first side of the multi-layersubstrate, depositing a liner in the bore, removing a layer from asecond side of the multi-layer substrate, wherein the removing exposes aclosed end of the liner, applying a non-wetting coating to the closedend of the liner and an area surrounding the closed end of the liner,and removing the closed end of the liner, wherein removing the closedend of the liner opens a nozzle.

Implementations can include one or more of the following features. Arecess may be etched in the oxide layer in first side of a multi-layersubstrate prior to etching the bore. The bore may be formed in the oxidelayer recess and may have a smaller diameter than the oxide layerrecess. Applying a non-wetting coating may include spin-coating aself-planarizing material, e.g., a fluoropolymer. The non-wettingcoating may be planarized prior to removing the closed end of the liner.The multi-layer substrate may include a silicon device layer, a buriedoxide layer, and a handle layer, and etching the bore may includeetching through the silicon device layer, the buried oxide layer, andonly partially into the handle layer. Removing a layer from a secondside of the multi-layer substrate may form a planar surface surroundingthe closed end of the liner and the closed end of the liner protrudesfrom the planar surface. The closed end of the liner may be thinnedprior to applying the non-wetting coating. An adhesion promoting layermay be applied to a second side of the multi-layer substrate prior toapplying the non-wetting coating. The adhesion promoting layer mayinclude metal, e.g., may consist of metal. The first side of themulti-layer substrate may be bonded to a body including a pumpingchamber so that the pumping chamber is in fluid communication with thenozzle upon completion. A recess may be etched in the first side of themulti-layer substrate, wherein the recess surrounds an outer diameter ofthe liner. A liner may be deposited in the bore, includes depositing aninitial liner having substantially parallel walls. A layer may beremoved from a second side of the multi-layer substrate to expose aclosed end of a nozzle liner. The initial liner may be removed afteretching the recess and forming the nozzle liner. The nozzle liner mayhave a tapered portion leading to substantially parallel walls. Thenozzle liner may be an oxide.

In another aspect, a method of forming a nozzle plate of a fluidejection device includes patterning a layer of a multi-layer substrate,wherein the multi-layer includes a nozzle inlet on a first side and thepatterning is performed in a region on the second side that correspondsto the nozzle inlet on the first side, after patterning the layer of themulti-layer substrate, applying a non-wetting coating to the second sideof the multi-layer substrate, patterning the non-wetting coating to forman aperture in the non-wetting coating, and opening an aperture in alayer of the multi-layer substrate through the aperture in thenon-wetting coating, wherein the opening creates a nozzle outlet that isin fluid communication with the nozzle inlet.

Implementations can include one or more of the following features.Patterning the layer of the multi-layer substrate may pattern anadhesion promoting layer. The adhesion promoting layer may includemetal. Spin-coating a non-wetting coating may include applying aself-planarizing material, e.g., a fluoropolymer. The non-wettingcoating may be planarized. Opening the aperture may include opening anaperture in an oxide layer.

In another aspect, a nozzle plate for a fluid ejection device includes adevice layer having a first surface and an opposing second surfaceparallel to the first side, a first oxide layer disposed on the firstside of the device layer, an adhesion promoting layer on the first oxidelayer, a non-wetting layer on the adhesion promoting layer, a secondoxide layer adjacent the second side of the device layer, and a nozzlepassage extending along a first axis perpendicular to the first surfaceof the device layer through the second oxide layer, the device layer,the first oxide layer, the adhesion promoting layer and the non-wettinglayer.

Implementations can include one or more of the following features. Thefirst oxide layer may have a thickness of two microns or less. Thesecond oxide layer has a thickness of one micron or more. The firstoxide layer and the second oxide layer may consist of silicon oxide. Theadhesion promoting layer may be a metal or a metal oxide, e.g., tantalumor titanium or an oxide of tantalum or titanium. The adhesion promotinglayer may be a planar film extending perpendicular to the first axis.The planar film of the adhesion promoting layer may not extend parallelto the first axis. A liner may coat an interior surface of the nozzle.The liner may coat the side of the second oxide layer farther from thedevice layer. The liner may be a nitride, silicon dioxide or metal. Endsof the liner may be rounded. The device layer may consists of silicon.The nozzle may include a tapered section. A top of the tapered sectionmay be aligned with a top of the device layer.

Certain implementations may have one or more of the followingadvantages. Methods of fabrication of the fluid ejector described hereincan provide for self-alignment of the apertures in the non-wettingcoating and the nozzles, thus improving alignment and reducing thelikelihood of non-straight jetting. Non-porous adhesion layers can beused to adhere the non-wetting coating to the nozzle plate. Non-porousadhesion layers are less likely to be attacked by aggressive fluids,e.g., alkaline inks than porous adhesion layers. Thus, the adhesionlayer is less likely to degrade. This allows the non-wetting coatinglayer to remain on the surface of the nozzle plate longer, extending thelife of the non-wetting coating layer and the time that the device isable to jet more accurately. Spin-on non-wetting coating layers can bemade thicker, which can make the coatings more robust than vapordeposited layers. The coatings described herein enable the device to beused with more corrosive materials. Thus, the jetting device has abroader applicability and flexibility in terms of the types of materialsthat it can jet.

The details of one or more implementations of the invention are setforth in the accompanying drawings and the description below. Otherfeatures, objects, and advantages will be apparent from the descriptionand drawings, and from the claims.

DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional side view of a single jetting structure.

FIGS. 2-16 show forming a nozzle with a non-wetting coating in a nozzleplate.

FIGS. 17-22 show forming a non-wetting coating on a nozzle plate.

FIGS. 23 and 24 are flow diagrams for forming non-wetting coatings onnozzle plates.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION

Vapor phase coatings can be susceptible to etching by particular typesof fluids, such as corrosive fluids, e.g., urea-containing inks On theother hand, certain types of spin coated materials, such asfluoropolymers, can be resistant to such corrosive fluids, but arepotentially subject to delamination. In order to address these problems,a non-porous adhesion layer can be used to adhere the non-wettingcoating to the nozzle plate. Non-porous adhesion layers are less likelyto be attacked by aggressive fluids, e.g., alkaline inks than porousadhesion layers.

Another difficulty in applying spin coated materials onto a nozzle layeris keeping the nozzles passages clear of the spin coated material. Ifthe coating is applied before the nozzle passages are opened to avoidthe material entering the nozzles, it can be difficult to preciselyphotolithographically align an aperture in the coating with a nozzlebore. The alignment difficulty can stem at least in part fromfront-to-back registration errors and small deformations in the nozzlelayer due to the nozzle layer being bonded to another layer andpotentially not being perfectly flat. Thus, warping can occur in thelocation of the nozzles with respect to a mask or grid that indicateswhere the nozzles should be located. Misregistration of the apertures inthe non-wetting coating and the nozzles can result in nozzle asymmetry,affecting the straightness of the ejected drops of fluid. In order toaddress these problems, some methods of fabrication of the fluid ejectorcan provide for self-alignment of the apertures in the non-wettingcoating and the nozzles, thus improving alignment and reducing thelikelihood of non-straight jetting.

FIG. 1 is a cross-sectional view of a single jetting structure of afluid ejector 100, such as an ink jet printing device. Similarstructures are described in U.S. application Ser. No. 12/712,614 filedFeb. 25 2010. Only a single jetting structure is shown, although a dieof a fluid ejector may include tens, hundreds or even thousands ofjetting structures.

A fluid, such as ink, enters the device, e.g., from a reservoir (notshown), through passage 20 in a body 10, e.g., an interposer. The body10 can be a cover layer that protects electrical components fromexposure to the fluid and optionally can include electrical elements,such as circuits. The fluid enters a fill channel 32 of a body 30, whichleads to a pumping chamber 35. A membrane 40 on the body 30 supports anactuator 50 above the pumping chamber 35. The actuator 50 is capable ofbending the membrane 40 either into or away from the pumping chamber 35,thereby expelling fluid out of the pumping chamber 35 through an orifice60 in a nozzle plate 55 or filling the pumping chamber 35 from an inletin the membrane 40. In some implementations, the nozzle has a diameterof between about 2 and 20 microns.

A non-wetting coating 65 is on the nozzle plate 55 as an outermost layerexposed to the environment. The non-wetting coating 65 is formed so thatthe orifice in the coating is aligned with the orifice 60 in the nozzleplate 55. The orifice 60 in the nozzle plate can be round, oval, square,or rectangular. Although many types of materials can be used fornon-wetting coatings, spin-on coatings are one option for non-wettingcoatings. The non-wetting coating can be formed from a fluoropolymer,such as a fluoropolymer that has good solubility in fluorinated solventdue to its amorphous morphology. Suitable spin-coatable fluoropolymerscan include perfluorotrialkylamine, such as Cytop^(TM), available fromAsahi Glass Company, Tokyo, Japan. One potential difficulty withapplying a spin-on non-wetting coating is aligning an aperture in thenon-wetting coating with the orifice in the nozzle layer, whilesimultaneously not introducing the non-wetting coating into the nozzle.

One implementation of a method for forming a nozzle plate is describedin FIG. 23. Details of this implementation the method are found in FIGS.2-16.

Referring to FIG. 2, a multi-layer substrate, such as an SOI wafer 200,includes a handle layer 210, a buried oxide layer 215, sometimesreferred to as the BOX, and a device layer 220. The handle layer 210 andthe device layer 220 can be silicon. In some implementations, the handlelayer 210 has a thickness of about 600 microns, the device layer 220 hasa thickness of about 30 microns and the buried oxide layer 215therebetween has a thickness of just a few microns, such as 2 or less,such as 1 micron. The multi-layer substrate has a first side or backside closest to the device layer 220 and a second side or front sideclosest to the handle layer 210.

Referring to FIG. 3, fiducials 230 are etched into the device layer 220.The fiducials 230 allow for alignment of masks at a later stage in theprocessing. An oxide layer 235, e.g., a thermal oxide, is grown on thedevice layer 220 and an oxide layer 240, e.g., a thermal oxide, is grownon the handle layer 210, opposite to the device layer 220. In someimplementations, the oxide layer 235 has a minimum thickness of 1micron. Referring to FIG. 4, a recess 250 is then etched into a firstside or back side of the multi-layer substrate (step 1010 in FIG. 23).In some implementations, the recess is formed in the oxide layer 235that directly contacts the device layer 220. The recess 250 forms anaperture that extends entirely through the oxide layer 235. The recess250 can be etched using a wet etch, such as a buffered oxide etch (BOE)etch, or with a dry etch. Lithography can be used to locate the recess250 in the desired location.

Referring to FIG. 5, a bore is etched into the first side of themulti-layer substrate (step 1020 of FIG. 23). A sacrificial layer 260,e.g., layer of resist is applied to the oxide layer 235. The sacrificiallayer 260 is patterned with an aperture having a desired cross section,such as round, oval, rectangular, square or other shape. The aperture inthe sacrificial layer 260 is located within the recess 250. The aperturein the sacrificial layer 260 can have a smaller lateral diameter thanthe lateral dimension of the aperture 250 in the oxide layer 235. Insome implementations, the aperture in the sacrificial layer is centeredwith a center of the recess 250 in the oxide layer 235. The multi-layersubstrate is then etched, using the sacrificial layer 260 as a mask, toform the bore or recess 265. Recess 265 extends through device layer220, through buried oxide layer 215 and partially into (but not entirelythrough) the handle layer 210. In some implementations, the etch intothe handle layer 210 is between about 1 and 5 microns, such as around 2microns. The recess 265 can be formed by multiple etch steps.

Referring to FIG. 6, a liner is deposited in the bore (step 1030 of FIG.23). The liner can be an initial liner 270 of multiple liners that areapplied. The initial liner 270 can protect the walls and floor of therecess 265 and part of the devcice layer from etching, e.g., from KOHetching. The resist 260 can be removed before the liner 270 is appliedso that the liner can be applied at high temperature. The initial liner270 can be a nitride, silicon dioxide or metal. A nitride liner can beformed by low pressure chemical vapor deposition (LPCVD). An oxide linercan be applied by plasma (PECVD) or thermal means. Metal can be appliedusing CVD. In one implementation, the initial liner can be depositedinto the recess 265 after the sacrificial layer 260 is removed. In someimplementations, the initial liner 270 has a minimum thickness of 0.2microns.

A dry etch can be used to remove the portion of the initial liner 270that is on the face of the device layer 220. The dry etch with etch theinitial liner 270 more slowly on the sidewalls and floor of the cavity235, so no mask may be needed to selectively leave the initial liner 270in these locations while removing it from the face of the device layer220, as shown in FIG. 8. Optionally, if a dry etch selectivity isinsufficient, the initial liner over the cavity 235 may be filled with aphotoresist 280 prior to dry etching, as shown in FIG. 7, and the photoresist can be stripped after the etch. In some implementations, theinitial liner 270 has a cylindrical wall layer and a bottom and ishollow along a central region. In some implementations, a cross sectionof the liner appears to be approximately T-shaped, with a closed bottom,a hollow vertical portion and horizontal portions extending outwardlyfrom a top of the liner.

Whether the resist is required can depend on the material of the initialliner 270. For example, if the initial liner 270 is formed of an oxide,it can be difficult to etch the oxide at the bottom of the liner region,that is, the portion closest to the handle layer 210, and the resist 280may not be required. The resist can be spun on, exposed and developed sothat it is only located in the desired regions and does not coat anentirety of the oxide layer 235.

Referring to FIG. 8, if any of the initial liner material remains on thedevice layer 220, the initial liner material is removed from a topsurface of the multi-layer substrate. An etch, such as a dry etch, canbe used to remove the initial liner material. The dry etch is selective,removing more material from horizontal surfaces than from verticalsurfaces. The etch can also thin the oxide layer 235.

Referring to FIG. 9, a funnel-shaped recess surrounding the initialliner is etched from the first side of the multi-layer substrate (step1040 of FIG. 23). The funnel 290 is etched around the initial liner andinto the device layer 220. A wet etch, e.g., a KOH etch, can be used toetch the funnel 290. If a resist 280 was present within the initialliner 270, the resist can be removed prior to etching the funnel. Insome implementations, the funnel 290 extends all the way down to theburied oxide layer 215. In some implementations, the funnel 290 extendspartially into, but not entirely through, the device layer 220. Becauseof the crystal planes of the silicon, the funnel shape can be afrusto-pyramidal shape, that is, a pyramid with the apex portion removedto have two parallel sides.

Referring to FIG. 10, optionally, the initial liner 270 is removed. Theinitial liner 270 can be stripped, such as with hot phosphoric acid fora silicon nitride liner or hydrofluoric (HF) acid for a silicon dioxideliner. A nozzle liner 300 is then formed in the recess where the initialliner was previously located. The nozzle liner 300 can be formed of anoxide or a nitride. The nozzle liner 300, like the initial liner, has abottom surface and walls surrounding a hollow space, such as cylindricalor rectangular walls, although other shapes for the space are possible.The nozzle liner 300 is formed to be less than about 1 micron thick,e.g., between 0.2 and 1 micron thick. In some implementations, the liner300 is a thermally grown oxide (in which case the liner may be presentonly on the surfaces of the device layer 220 and handle layer 210. Insome implementations, only a single liner is formed rather than formingtwo separate liners. Therefore, the initial liner and the nozzle linerare the same.

The first side of the multi-layer substrate, such as the oxide layer 235or the liner 300, is bonded to a new layer, as shown in FIG. 11. In someimplementations, the new layer is a base substrate 310 that includesfeatures of the jetting device, such as the pumping chamber, asdescribed with respect to FIG. 1. The base substrate 310 can be bondedto the multi-layer substrate using a bonding material or by fusionbonding silicon to silicon or silicon to silicon oxide.

A portion of the liner, such as a closed off end portion closest to thesecond side of the multi-layer substrate is then exposed by removinglayers from the second side or the front side of the multi-layersubstrate (step 1050 of FIG. 23). As shown in FIG. 12, the oxide layer240 and the handle layer 210 are removed. The removal can be achieved bya combination of grinding, polishing and dry etching. For example, theoxide layer 240 can be removed by dry etch, the handle layer 210 can bepartially removed by grinding and the remaining handle layer materialafter the grinding process can be etched using a wet or dry etch that isselective to the thermal oxide 300 and buried oxide layer 215. Removingmaterial from the second side of the multi-layer substrate forms aplanar surface surrounding a closed end of the nozzle liner 300. In someimplementations, the nozzle liner 300 protrudes out from surroundingplanar surface. Optionally, the nozzle liner 300, such as the portion ofthe nozzle liner 300 that is a closed end, can be thinned

Referring to FIG. 13, optionally an adhesion promoting layer 330 isapplied to the now-exposed buried oxide layer 215. In someimplementations, the adhesion promoting layer 330 is a layer of metal,such as tantalum or titanium or an oxide of one of these materials. Insome implementations, the adhesion promoting layer 330 is a siliconeadhesion promoter. In some implementations, the adhesion promoting layer330 is non-porous and can be continuous without pinholes. However theadhesion promoting layer 330 can be formed of any material that helpsadhere the subsequent non-wetting coating to the device.

Referring to FIG. 14, a layer of non-wetting material is applied to thesecond side of the multi-layer substrate (step 1060). The non-wettingmaterial can either be self-planarizing or can be planarized to form aplanar surface to the non-wetting layer 340. As noted above, thenon-wetting material can be a fluorocarbon material, such as Teflon(PTFE) or Cytop™. In some embodiments, the non-wetting layer 340 isapplied with a thickness of 0.5 microns or more, such as 1 micron ormore. A relatively thick, e.g., greater than 1 micron non-wetting layer340 can be desirable when the material etches faster than the adhesionpromoting layer or the oxide layer on which it is applied. As analternative to spin coating, the material can be applied by spraycoating or chemical vapor deposition (CVD). Some types of coatings, suchas CVD applied coatings and spray coatings are not self leveling, butare conformal. Chemical mechanical polishing (CMP) can be used toplanarize conformal coatings as well as to expose the bottom surface ofthe nozzle liner 300 so that the nozzle can be opened.

Referring to FIG. 15, the portion of the nozzle liner that is adjacentto the second side of the multi-layer substrate is removed to open thenozzle bore (step 1070 of FIG. 23). The non-wetting layer 340, theoptional adhesion promoting layer 330 and the bottom of the nozzle liner300 layer are etched to open of the nozzle. Some non-wetting coatingmaterials act as a resist. Thus, the non-wetting coating 340 after beingpatterned to have an aperture aligned with the nozzle, is used as a maskin an etching process to etch through the adhesion promoting layer 330and nozzle liner 300. The non-wetting coating can be etched, such as bya dry plasma etch, e.g., a CF₄ plasma etch. The etching can thin thenon-wetting coating. The optional adhesion promoting layer 330 and thebottom of the nozzle liner 300 layer can be etched with suitable etchingconditions.

Referring to FIG. 16, without the adhesion promoting layer, thenon-wetting layer 340 is closer to the outer diameter of the nozzle. Ascan be seen, the etching can form a radiused end on the nozzle liner 300layer that defines the nozzle aperture. Also, if the non-wetting coatingetches too much faster than the oxide that defines the nozzle, this cancause the nozzle to have a projecting portion 350. If a wiping mechanismis used to clean the nozzle plate, such as to maintain the nozzle plate,the projecting nozzles can be too fragile for cleaning. Thus, it can beadvantageous to reduce any projections on the nozzle plate, such as byoptimizing the thickness of the non-wetting coating when it is applied,or etching off the protruding film with a vapor or plasma process.

In an alternative method, instead of the nozzle negative space beingformed entirely from one side of the multi-layer substrate, the nozzlecan be formed from both sides of a multi-layer substrate. The method isdescribed in FIG. 24 and the steps are shown in FIGS. 17-22.

Referring to FIG. 17, a nozzle inlet 400 is formed in a multi-layersubstrate 405, such as in a first side or back side of the multi-layersubstrate. The nozzle inlet 400 can be formed in a layer of silicon 410,such as by wet etching, e.g., KOH etching, the silicon. The wet etch canprovide the inlet 400 with tapered sides, e.g., a frusto-pyramidalshape. The etch stops on an oxide layer 420. The oxide layer 420 is aplanar intact or continuous layer. Optionally, an adhesion promotinglayer, such as a metal layer 430, for example a layer of titanium ortantalum, is on an opposite side of the oxide layer 420 from the nozzleinlet 400, that is, on the second side of the multi-layer substrate.Alternatively, a metal oxide layer, such as Ta₂O₅ or TiO₂ is usedinstead of metal layer 430.

A resist is formed on the second side of the multi-layer substrate (step1110 of FIG. 24). Thus, the layer of photoresist 440 is on an oppositeside of the metal layer 430 from the oxide layer 420. The layer ofphotoresist 440 is patterned with the desired nozzle outlet geometry anddimensions. The layer of photoresist 440 is patterned so that a nozzleoutlet will be formed in a region on the second side of the multi-layersubstrate that corresponds to the nozzle inlet 400 on the first side ofthe multi-layer substrate and so that the inlet and the outlet are influid communication with one another once the nozzle plate is completed.The photoresist 440 can be patterned by aligning fiducials in thesubstrate to a mask. The nozzle layer can be processed prior to beingadhered to another layer to reduce any likelihood of the nozzle layerbeing deformed due to bonding.

Referring to FIG. 18, the aperture formed in the photoresist 440 is usedto pattern the second side of the multi-layer substrate, such as anadhesion promoting layer (step 1120 of FIG. 24). That is, thephotoresist 440 is used as a mask in etching of the underlying layer. Ifthe adhesion promoting layer is a metal layer 430, the metal layer 430can be etched, such as with HF. The photoresist 440 is stripped. Anon-wetting coating layer 460 is then formed on the second side of themulti-layer substrate (step 1140 of FIG. 24). The non-wetting coatinglayer 460 fills the aperture 450 and forms a planar surface 470, asshown in FIG. 19. If the non-wetting coating layer 460 is conformal tothe recesses in the metal layer 430, the layer can be polished or etchedto form the planar surface 470. A further layer of photoresist 480 isapplied to the non- wetting coating layer 460 and patterned, as shown inFIG. 20. The mask for patterning the photoresist can be aligned usinginfrared or front-back alignment techniques with a stepper. Thedimensions of the aperture formed in the further layer of photoresist480 are wider than the aperture in the metal layer 430. The non-wettingcoating layer 460 is then patterned (step 1150 of FIG. 24), as shown inFIG. 21, e.g., using the photoresist 480 as a mask in an etch step thatetches the underlying non-wetting coating 460. Optionally, the furtherlayer of photoresist 480 is removed.

Referring to FIG. 22, the oxide layer 420 from the second side of themulti-layer substrate is etched to complete the nozzle opening (step1160 of FIG. 24). This series of steps forms a nozzle plate withnozzles, which can then be bonded to a device body.

As an alternative, a metal layer, such as a layer of nickel, can be usedinside of the oxide.

A number of embodiments of the invention have been described.Nevertheless, it will be understood that various modifications may bemade. Accordingly, other embodiments are within the scope of thefollowing claims.

All references referred to herein are incorporated by reference for thepurpose of their disclosure.

1-15. (canceled)
 16. A method of forming a nozzle plate of a fluidejection device, comprising: patterning a layer of a multi-layersubstrate, wherein the multi-layer includes a nozzle inlet on a firstside and the patterning is performed in a region on the second side thatcorresponds to the nozzle inlet on the first side; after patterning thelayer of the multi-layer substrate, applying a non-wetting coating tothe second side of the multi-layer substrate; patterning the non-wettingcoating to form an aperture in the non-wetting coating; and opening anaperture in a layer of the multi-layer substrate through the aperture inthe non-wetting coating, wherein the opening creates a nozzle outletthat is in fluid communication with the nozzle inlet.
 17. The method ofclaim 16, wherein patterning the layer of the multi-layer substratepatterns an adhesion promoting layer.
 18. The method of claim 17,wherein the adhesion promoting layer includes metal.
 19. The method ofclaim 16, wherein spin-coating a non-wetting coating includes applying aself-planarizing material.
 20. The method of claim 19, wherein theself-planarizing material is a fluoropolymer.
 21. The method of claim16, further comprising planarizing the non-wetting coating.
 22. Themethod of claim 16, wherein opening the aperture includes opening anaperture in an oxide layer. 23-37. (canceled)